thermal cycle loading meaning in Chinese
热循环加载
Examples
- According to the m1l - std - 883c standard of thermal cycle loading , the delamination propagation rates at the interface between chip and underfill were studied experimentally by using c - mode scanning acoustic microscope ( c - sam ) for two types of flip chip packages with different states of solder joint
采用mil - std - 883c标准，通过温度循环实验，使用高频超声显微镜( c - sam )无损检测技术，测量了在不同焊点状态下， b型和d型两种实际倒装焊封装芯片与底充胶界面分层裂缝传播速率。